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Interfacing vapor chambers with plates and heat exchangers is predominately about maximizing the contact area. In most cases, the vapor chambers are soldered to the heat exchanger fins for air cooled applications. In many cases, the vapor chambers are also integrated with heat pipes to take the heat that has spread in the plane of the vapor chamber and extend it in the vertical dimension to more efficiently interact with cooling fins. Integrating with the heat source is most commonly done with pressure, up to 90 psi, and the use of a thermal grease or other interface material to maximize surface area contact to the source.
PTM Published on: 2017-12-26
