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summary
In summary, Wakefield Thermal’s standard vapor chambers offer superior thermal spreading performance over traditional solid metal heat spreaders by taking advantage of two-phase liquid/vapor transport. The lower weight and height over traditional solutions couples with the high thermal conductivity to give extremely low thermal resistance in-plane as well as through the thickness of the vapor chamber. Vapor Chambers are best suited for components with high heat densities (larger TDP in small chip sizes) which need to spread the heat to a larger area heat exchanger to achieve safe operating temperatures, thereby providing extended life and reliability for components and applied products.
PTM Published on: 2017-12-26