In summary, Infineon’s HYPERRAM™ devices are high-speed, self-refresh dynamic RAM (DRAM) with a HYPERBUS™ interface, making them ideal for SoCs with limited RAM by providing a scalable expansion memory solution. HYPERRAM supports read/write bandwidth of up to 800MBps and are available in densities ranging from 64Mb to 512Mb in space-saving 8mm x 6mm ball grid array (BGA) package. When paired with HYPERFLASH™ memory, both products can utilize the same HYPERBUS interface resulting in significant reduction in the number of signals that need to be routed on the printed circuit board (PCB) compared to generic DRAM based solutions. This leads to a simple, cost-effective solution for system-level designers. HYPERRAM devices are both industrial and automotive qualified and support an operating temperature range up to +125°C. Infineon applies stringent testing and qualification processes to ensure the parts meet AEC-Q100 quality requirements.