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It is no longer rare for IC chips that had previously been provided in relatively large packages using through-holes (such as the TO-220 package) to be embedded in far smaller surface-mount packages. Approaches involving higher integration levels are also taken. For example, two IC chips are provided in the same package in a dual configuration, or else a chip equivalent to two components is incorporated in a package to raise the integration level, thereby raising the ratio of functionality to footprint. Such component miniaturization and elevated integration levels act to increase heat generation. The thermal images on the left are an example of package miniaturization, comparing packages measuring 20 x 20 x 20 mm and 10 x 10 x 10 mm that consume the same power. The right side is an example of higher integration, comparing the same size package with one chip and with two chips; the difference in temperatures is obvious.
