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ROHM's Approach to Achieve High Solder Joint Reliability

The illustrations here shows an example of a mounting problem. If there is no margin in the package height ② for the element size ①, there is a concern that the die-bond material (Ag paste) may protrude as shown in ③. Side-view packages are plated to improve the mountability, so part ③ other than the electrodes is also plated, as shown in ④. If solder adheres to ④, can cause a variety issues, including mounting misalignment, short-circuit, and device degradation due to reflow heat. ROHM’s design ensures high solder joint reliability using high-efficiency (high power) chips to ensure sufficient margin for the die-bonding area.

PTM Published on: 2021-05-18