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In addition to superior reliability and module longevity, modules built with the arcTEC™ structure also offer enhanced thermal performance. These Peltier modules integrate P/N elements made from premium silicon ingot that are as much as 2.7 times larger than those used by other thermoelectric modules on the market. This can have a significant impact on thermal performance, as larger elements result in faster, more uniform cooling. IR inspection shows an even temperature distribution across the surface of the ceramic substrate for units built with the arcTEC™ structure. Conventional units, in contrast, exhibit multiple temperature variations, indicating diminished cooling performance and higher risk of a shorter working life. These temperature variations can result from inferior P/N element quality, smaller element size, or poor solder quality within the module. Modules utilizing larger P/N elements cool at a faster rate and without a drop-off in performance. In field testing, modules utilizing the arcTEC™ structure demonstrated a greater than 50% improvement in cooling time compared to competing modules. This dramatic difference can be attributed to both the size and quality of the P/N elements as well as to the improved reliability the arcTEC™ structure provides.
