IC Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature

28-516-11 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	10 In Stock	1 : ¥133.16000 Bulk	516	Bulk	Active	DIP, ZIF (ZIP)	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
40-516-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	20 In Stock	1 : ¥167.89000 Bulk	516	Bulk	Active	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-516-11 CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	0 In Stock Check Lead Time	45 : ¥101.34444 Bulk	516	Bulk	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-516-11S CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	0 In Stock Check Lead Time	45 : ¥101.34444 Bulk	516	Bulk	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-516-11M CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics	0 In Stock Check Lead Time	39 : ¥105.56641 Bulk	516	Bulk	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-516-11S CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	0 In Stock Check Lead Time	39 : ¥113.49615 Bulk	516	Bulk	Active	DIP, ZIF (ZIP)	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
40-516-11S CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	0 In Stock Check Lead Time	30 : ¥137.88767 Bulk	516	Bulk	Active	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
40-516-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	0 In Stock	Obsolete	516	Bulk	Obsolete	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-516-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	0 In Stock	Obsolete	516	Bulk	Obsolete	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-516-10 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	0 In Stock	Obsolete	516	Bulk	Obsolete	DIP, ZIF (ZIP)	28 (2 x 14)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-

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IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.