System On Chip (SoC)

Results: 3
Series
-DARWIN
Packaging
Tape & Reel (TR)Tray
Core Processor
ARM® Cortex®-M4ARM® Cortex®-M4F
Flash Size
512kB512KB
Peripherals
DMA, I2S, PWM, WDTI2S, PWM, WDT
Connectivity
1-Wire, Bluetooth, I2C, SPI, UART/USARTBluetooth, I2C, SPI, UART
Operating Temperature
-40°C ~ 105°C-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)
Package / Case
81-LFBGA88-VFLGA Exposed Pad
Supplier Device Package
81-CTBGA (8x8)88-LGA (10x10)
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
564
In Stock
696
Factory
1 : ¥59.35000
Tray
-
Tray
Active
MCU
ARM® Cortex®-M4
512KB
128kB
I2S, PWM, WDT
1-Wire, Bluetooth, I2C, SPI, UART/USART
100MHz
-
-40°C ~ 105°C
81-LFBGA
81-CTBGA (8x8)
967
In Stock
1 : ¥123.63000
Tray
-
Tray
Active
MCU
ARM® Cortex®-M4F
512kB
128kB
DMA, I2S, PWM, WDT
Bluetooth, I2C, SPI, UART
100MHz
-
-40°C ~ 85°C (TA)
88-VFLGA Exposed Pad
88-LGA (10x10)
0
In Stock
7,500
Factory
Check Lead Time
2,500 : ¥47.76792
Tape & Reel (TR)
Tape & Reel (TR)
Active
MCU
ARM® Cortex®-M4F
512KB
128kB
DMA, I2S, PWM, WDT
Bluetooth, I2C, SPI, UART
100MHz
-
-40°C ~ 105°C (TA)
81-LFBGA
81-CTBGA (8x8)
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of 3

System On Chip (SoC)


Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.